Essential details
Shipping:Express Delivery
Product Introduction
Key Features
- Ultra-High Density Interconnection: Features micro-vias and line widths/spacings down to 20–50 μm, supporting hundreds to thousands of I/O pins for advanced chips like CPUs, GPUs, and HBM memory.
- Advanced Materials: Utilizes high-performance laminates (e.g., ABF resin) with stable dielectric properties, ensuring signal integrity and impedance control at GHz frequencies.
- BGA Ball Grid Array: Equipped with solder balls on the bottom for reliable connection to the motherboard, offering high mechanical strength and electrical conductivity.
- Thermal Management: Integrates metal cores or thermal vias to efficiently dissipate heat from high-power chips, preventing thermal throttling and ensuring long-term reliability.
Typical Applications
- High-Performance Computing (HPC): CPUs, GPUs, and AI accelerators in servers and workstations.
- Consumer Electronics: Application processors in smartphones, tablets, and gaming consoles.
- Memory Modules: HBM (High Bandwidth Memory) and advanced DDR modules.
- Automotive & Industrial: Power management ICs (PMICs) and ADAS processors requiring high reliability.
